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Discover 59 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
188
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 516BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
260
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 416BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
346
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
420
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 473MAPBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA，POR，PWM，WDT | e200z7d | 180MHz | 2MB (2M x 8) | 64K x 8 | 1.14 V ~ 5.5 V | A/D 34x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 257MAPBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA，POR，PWM，WDT | e200z7d | 180MHz | 2MB (2M x 8) | 64K x 8 | 1.14 V ~ 5.5 V | A/D 22x12b | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1500 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 880 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 176 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Bulk | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 176 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 264MHz | 8MB (8M x 8) | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core |
