Package / Case:
Supplier Device Package:
RAM Size:
Program Memory Size:
Discover 5 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package RAM Size Program Memory Size
S1C17W23F101100
Epson Electronics America Inc-Semiconductor Div
900
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 96KB FLASH 128TQFP
Tray 128-TQFP 128-TQFP (14x14) 8K x 8 96KB (96K x 8)
S1C17W22F101100
Epson Electronics America Inc-Semiconductor Div
Inquiry
-
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 128TQFP
Tray 128-TQFP 128-TQFP (14x14) 4K x 8 64KB (64K x 8)
S1C17W22D101100
Epson Electronics America Inc-Semiconductor Div
Inquiry
-
-
MOQ: 1050  MPQ: 1
IC MCU 16BIT 64KB FLASH DIE
Tray Die Die 4K x 8 64KB (64K x 8)
S1C17W22D00B000
Epson Electronics America Inc-Semiconductor Div
Inquiry
-
-
MOQ: 1200  MPQ: 1
IC MCU 16BIT 64KB FLASH DIE
Tape & Reel (TR) Die - 4K x 8 64KB (64K x 8)
S1C17W22F00B100
Epson Electronics America Inc-Semiconductor Div
Inquiry
-
-
MOQ: 900  MPQ: 1
IC MCU 16BIT 64KB FLASH 128TQFP
Tray 128-TQFP - 4K x 8 64KB (64K x 8)