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- Packaging:
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- Operating Temperature:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- Speed:
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Discover 23 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
STMicroelectronics |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 32-WLCSP
|
Tape & Reel (TR) | STM8L EnergyLite | -40°C ~ 85°C (TA) | 32-UFBGA,WLCSP | - | Brown-out Detect/Reset,DMA,IR,LCD,POR,PWM,WDT | STM8 | 16MHz | 4K x 8 | 64KB (64K x 8) | 1.8 V ~ 3.6 V | A/D 20x12b,D/A 1x12b | I2C,IrDA,SPI,UART/USART | 8-Bit | ||||
STMicroelectronics |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 32-WLCSP
|
Cut Tape (CT) | STM8L EnergyLite | -40°C ~ 85°C (TA) | 32-UFBGA,WLCSP | - | Brown-out Detect/Reset,DMA,IR,LCD,POR,PWM,WDT | STM8 | 16MHz | 4K x 8 | 64KB (64K x 8) | 1.8 V ~ 3.6 V | A/D 20x12b,D/A 1x12b | I2C,IrDA,SPI,UART/USART | 8-Bit | ||||
STMicroelectronics |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 32-WLCSP
|
- | STM8L EnergyLite | -40°C ~ 85°C (TA) | 32-UFBGA,WLCSP | - | Brown-out Detect/Reset,DMA,IR,LCD,POR,PWM,WDT | STM8 | 16MHz | 4K x 8 | 64KB (64K x 8) | 1.8 V ~ 3.6 V | A/D 20x12b,D/A 1x12b | I2C,IrDA,SPI,UART/USART | 8-Bit | ||||
NXP USA Inc. |
457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC11Axx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 6K x 8 | 24KB (24K x 8) | 2.6 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | I2C,Microwire,SPI,SSI,SSP,UART/USART | 32-Bit | ||||
NXP USA Inc. |
832
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
465
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M3 | 72MHz | 8K x 8 | 32KB (32K x 8) | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 128KB (128K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 96
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 96KB (96K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 96
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 96KB (96K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 128KB (128K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48LQFP
|
Tray | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | HCS12Z | 32MHz | 8K x 8 | 96KB (96K x 8) | 3.5 V ~ 40 V | A/D 10x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 128KB (128K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 96
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 96KB (96K x 8) | 3.5 V ~ 40 V | A/D 10x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 96
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 96KB (96K x 8) | 3.5 V ~ 40 V | A/D 10x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 8K x 8 | 128KB (128K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x12b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,POR,PWM,WDT | S12Z | 32MHz | 12K x 8 | 192KB (192K x 8) | 3.5 V ~ 40 V | A/D 10x10b,D/A 1x8b | CANbus,I2C,SCI,SPI | 16-Bit |