- Manufacturer:
-
- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Peripherals:
-
- Core Processor:
-
- Speed:
-
- RAM Size:
-
- Program Memory Type:
-
- EEPROM Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Oscillator Type:
-
- Connectivity:
-
- Core Size:
-
- Selected conditions:
Discover 93 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
2,137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,PWM,WDT | ARM Cortex-M0+ | 40MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,550
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32QFN
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | LVD,PWM,WDT | ARM Cortex-M0+ | 40MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1,793
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,PWM,WDT | ARM Cortex-M0+ | 20MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
35,445
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 2K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 48MHz | 2K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D 14x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M3 | 72MHz | 4K x 8 | Flash | - | 2 V ~ 3.6 V | A/D 8x10b | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | 32-Bit | ||||
Renesas Electronics America |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 40HWQFN
|
Tape & Reel (TR) | RL78/G13 | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-HWQFN (6x6) | DMA,LVD,POR,PWM,WDT | RL78 | 32MHz | 2K x 8 | Flash | - | 1.6 V ~ 5.5 V | A/D 9x8/10b | Internal | CSI,I2C,LINbus,UART/USART | 16-Bit | ||||
Renesas Electronics America |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 40HWQFN
|
Cut Tape (CT) | RL78/G13 | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-HWQFN (6x6) | DMA,LVD,POR,PWM,WDT | RL78 | 32MHz | 2K x 8 | Flash | - | 1.6 V ~ 5.5 V | A/D 9x8/10b | Internal | CSI,I2C,LINbus,UART/USART | 16-Bit | ||||
Renesas Electronics America |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 40HWQFN
|
- | RL78/G13 | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-HWQFN (6x6) | DMA,LVD,POR,PWM,WDT | RL78 | 32MHz | 2K x 8 | Flash | - | 1.6 V ~ 5.5 V | A/D 9x8/10b | Internal | CSI,I2C,LINbus,UART/USART | 16-Bit | ||||
STMicroelectronics |
1,470
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
|
Tray | STM32L0 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | ARM Cortex-M0+ | 32MHz | 2K x 8 | Flash | 512 x 8 | 1.65 V ~ 3.6 V | A/D 10x12b | Internal | I2C,IrDA,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 48MHz | 2K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D 14x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1,235
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | S08 | 20MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C,LINbus,SPI,UART/USART | 8-Bit | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | S08 | 20MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C,LINbus,SPI,UART/USART | 8-Bit | ||||
NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | ARM Cortex-M0+ | 40MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC11Axx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 4K x 8 | Flash | 1K x 8 | 2.6 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1,742
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM,WDT | S08 | 20MHz | 2K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | I2C,LINbus,SPI,UART/USART | 8-Bit | ||||
NXP USA Inc. |
320
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 2K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
674
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
205
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 50MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit |