- Manufacturer:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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Discover 133 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
7,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 10K x 8 | 32KB (32K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
8,693
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | ARM Cortex-M0 | 50MHz | 12K x 8 | 64KB (64K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
5,673
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M3 | 72MHz | 12K x 8 | 64KB (64K x 8) | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
913
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 6K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
2,125
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | ARM Cortex-M0 | 50MHz | 8K x 8 | 32KB (32K x 8) | 2K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
721
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 6K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
407
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 48KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M3 | 72MHz | 8K x 8 | 48KB (48K x 8) | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
591
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M3 | 72MHz | 10K x 8 | 64KB (64K x 8) | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 40KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 8K x 8 | 40KB (40K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
323
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 10K x 8 | 64KB (64K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
254
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M3 | 72MHz | 10K x 8 | 32KB (32K x 8) | 2K x 8 | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 6K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tape & Reel (TR) | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 33-HVQFN (5x5) | ARM Cortex-M0 | 50MHz | 12K x 8 | 64KB (64K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 48KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M0 | 50MHz | 10K x 8 | 48KB (48K x 8) | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 48KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM Cortex-M3 | 72MHz | 10K x 8 | 48KB (48K x 8) | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
32QFN IND TEMP,GREEN,1.6-3.6V,4
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.62 V ~ 3.6 V | A/D 10x12b,D/A 1x10b | I2C,SPI,UART/USART | ||||
Microchip Technology |
5,020
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32QFN IND TEMP,GREEN,1.6-3.6V,4
|
Cut Tape (CT) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.62 V ~ 3.6 V | A/D 10x12b,D/A 1x10b | I2C,SPI,UART/USART | ||||
Microchip Technology |
5,020
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32QFN IND TEMP,GREEN,1.6-3.6V,4
|
- | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.62 V ~ 3.6 V | A/D 10x12b,D/A 1x10b | I2C,SPI,UART/USART | ||||
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.62 V ~ 3.6 V | A/D 10x12b,D/A 1x10b | I2C,SPI,UART/USART | ||||
Microchip Technology |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Cut Tape (CT) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.62 V ~ 3.6 V | A/D 10x12b,D/A 1x10b | I2C,SPI,UART/USART |