- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- RAM Size：
-
- Program Memory Size：
-
- Selected conditions:
Discover 92 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Speed | RAM Size | Program Memory Size | Connectivity | |
|
|
|
NXP USA Inc. |
346
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 100MAPBGA
|
Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
288
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 100MAPBGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | - | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/120MHz | 512K x 8 | 4MB (4M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 256MAPBGA
|
Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/120MHz | 512K x 8 | 4MB (4M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 176LQFP
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | 129 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 256MAPBGA
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | 178 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG |
