- Packaging:
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- Operating Temperature:
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- Peripherals:
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- RAM Size:
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- Program Memory Size:
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- Program Memory Type:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Connectivity:
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- Selected conditions:
Discover 19 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
1,448
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
170
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 200K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
277
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 264K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 1MB (1M x 8) | Flash | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
268
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 168K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 264K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 282K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 16x10b,6x12b,D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
248
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
110
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
164
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 154K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.4 V ~ 3.6 V | A/D 16x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,QEI,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 154K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.4 V ~ 3.6 V | A/D 16x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,QEI,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 264K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 768KB (768K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 100BGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 768KB (768K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | -40°C ~ 105°C (TA) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | 136K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG |