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- Number of I/O:
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Discover 90 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Oscillator Type | Connectivity | ||
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
- | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
1,482
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
14,126
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | 22 | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
5,456
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | LPC11Uxx | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 80 | 50MHz | 36K x 8 | 256KB (256K x 8) | 4K x 8 | 2.4 V ~ 3.6 V | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | ||||
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
Tape & Reel (TR) | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | 14 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | Internal | I2C,LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
Cut Tape (CT) | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | 14 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | Internal | I2C,LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS E 32-BIT MCU ARM CORTEX
|
- | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | 14 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | Internal | I2C,LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
1,334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 33-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 29 | 30MHz | 4K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
4,197
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD,POR,PWM,WDT | 22 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | Internal | I2C,LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
489
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | 22 | 48MHz | 2K x 8 | 16KB (16K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
1,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Tube | LPC80xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset,POR,PWM,WDT | 17 | 15MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
418
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Tray | LPC51U | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 37 | 100MHz | 96K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.6 V | Internal | Flexcomm,I2C,SPI,UART/USART,USB | ||||
NXP USA Inc. |
741
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Tray | LPC51U | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | 48 | 100MHz | 96K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.6 V | Internal | Flexcomm,I2C,SPI,UART/USART,USB | ||||
NXP USA Inc. |
152
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 100LQFP
|
Tray | LPC11Exx | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | 80 | 50MHz | 20K x 8 | 128KB (128K x 8) | 4K x 8 | 2.4 V ~ 3.6 V | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART | ||||
NXP USA Inc. |
757
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | 22 | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
575
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
|
Tube | Kinetis KEA | -40°C ~ 125°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | 14 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | Internal | I2C,LINbus,SPI,UART/USART | ||||
NXP USA Inc. |
764
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | 22 | 48MHz | 2K x 8 | 16KB (16K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART | ||||
NXP USA Inc. |
880
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | 22 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 1.71 V ~ 3.6 V | Internal | I2C,SPI,UART/USART |