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Discover 49 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Data Converters | Oscillator Type | |
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NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | Internal | ||
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NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | Internal | ||
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NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
- | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | Internal | ||
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NXP USA Inc. |
14,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Tube | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 18 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
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|
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NXP USA Inc. |
1,482
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 29 | 8K x 8 | 32KB (32K x 8) | A/D 12x12b | Internal | ||
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|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Tape & Reel (TR) | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 18 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
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|
|
NXP USA Inc. |
5,910
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Cut Tape (CT) | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 18 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
|
|
|
NXP USA Inc. |
5,910
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
- | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 18 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
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|
|
NXP USA Inc. |
1,334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 33-HVQFN (5x5) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 29 | 4K x 8 | 16KB (16K x 8) | A/D 12x12b | Internal | ||
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NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | LPC81xM | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 2K x 8 | 8KB (8K x 8) | - | Internal | ||
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NXP USA Inc. |
6,760
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
|
Cut Tape (CT) | LPC81xM | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 2K x 8 | 8KB (8K x 8) | - | Internal | ||
|
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|
NXP USA Inc. |
6,760
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16TSSOP
|
- | LPC81xM | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 2K x 8 | 8KB (8K x 8) | - | Internal | ||
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NXP USA Inc. |
4,000
|
3 days |
-
|
MOQ: 4000 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16XSON
|
Tape & Reel (TR) | LPC81xM | -40°C ~ 105°C (TA) | 16-XFDFN | 16-XSON (3.2x2.5) | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
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NXP USA Inc. |
4,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16XSON
|
Cut Tape (CT) | LPC81xM | -40°C ~ 105°C (TA) | 16-XFDFN | 16-XSON (3.2x2.5) | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
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NXP USA Inc. |
4,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16XSON
|
- | LPC81xM | -40°C ~ 105°C (TA) | 16-XFDFN | 16-XSON (3.2x2.5) | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
|
|
|
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Tape & Reel (TR) | LPC84x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，Cap Sense，DMA，POR，PWM，WDT | 29 | 16K x 8 | 64KB (64K x 8) | A/D 12x12b，D/A 1x10b | Internal/External | ||
|
|
|
NXP USA Inc. |
11,444
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Cut Tape (CT) | LPC84x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，Cap Sense，DMA，POR，PWM，WDT | 29 | 16K x 8 | 64KB (64K x 8) | A/D 12x12b，D/A 1x10b | Internal/External | ||
|
|
|
NXP USA Inc. |
11,444
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
- | LPC84x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset，Cap Sense，DMA，POR，PWM，WDT | 29 | 16K x 8 | 64KB (64K x 8) | A/D 12x12b，D/A 1x10b | Internal/External | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16TSSOP
|
Tape & Reel (TR) | LPC81xM | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 4K x 8 | 16KB (16K x 8) | - | Internal | ||
|
|
|
NXP USA Inc. |
1,201
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16TSSOP
|
Cut Tape (CT) | LPC81xM | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | 14 | 4K x 8 | 16KB (16K x 8) | - | Internal |
