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Discover 1,790 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
15,000
|
3 days |
-
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MOQ: 5000 MPQ: 1
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IC MCU 32BIT 32KB FLASH 20WLCSP
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Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 2K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 7x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
19,598
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
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Cut Tape (CT) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 2K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 7x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
19,598
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 2K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 7x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 3000 MPQ: 1
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IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 10x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
5,559
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 10x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
5,559
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 18 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 10x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
7,078
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 22 | 2K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 7x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
7,743
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 16QFN
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Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | 14 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 6x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
34,383
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 32QFN
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Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 28 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | I2C，LINbus，SPI，TSI，UART/USART | ||
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NXP USA Inc. |
19,527
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 32QFN
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Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-UFQFN Exposed Pad | 32-QFN (5x5) | DMA，I2S，PWM，WDT | 28 | 16K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D 11x16b | I2C，FlexIO，SPI，UART/USART | ||
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NXP USA Inc. |
14,126
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 22 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 12x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
5,609
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 28 | 8K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | I2C，LINbus，SPI，TSI，UART/USART | ||
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NXP USA Inc. |
4,237
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 32LQFP
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 28 | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 14x12b | I2C，SPI，UART/USART | ||
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NXP USA Inc. |
2,784
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 32-UFQFN Exposed Pad | 32-QFN (5x5) | DMA，I2S，PWM，WDT | 24 | 8K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 8x16b | I2C，FlexIO，SPI，UART/USART，USB | ||
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Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 32QFN
|
Tape & Reel (TR) | SAM L21E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 25 | 32K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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Microchip Technology |
7,740
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 32QFN
|
Cut Tape (CT) | SAM L21E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 25 | 32K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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|
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Microchip Technology |
7,740
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 32QFN
|
- | SAM L21E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 25 | 32K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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|
NXP USA Inc. |
4,677
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus，I2C，LINbus，SPI，UART/USART | ||
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|
|
NXP USA Inc. |
22,033
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 40 | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | I2C，LINbus，SPI，TSI，UART/USART | ||
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NXP USA Inc. |
7,534
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 80LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 80-LQFP | 80-LQFP (14x14) | LVD，POR，PWM，WDT | 71 | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | CANbus，I2C，LINbus，SPI，UART/USART |
