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Discover 32 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|
|
|
NXP USA Inc. |
15,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 2K x 8 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 2K x 8 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 2K x 8 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | 18 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b | ||
|
|
|
NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | 18 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b | ||
|
|
|
NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | 18 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b | ||
|
|
|
NXP USA Inc. |
7,078
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 2K x 8 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
7,743
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 16QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 4K x 8 | 32KB (32K x 8) | A/D 6x12b | ||
|
|
|
NXP USA Inc. |
3,735
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 2K x 8 | 8KB (8K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
4,614
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 2K x 8 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
5,223
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 16QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 2K x 8 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
2,800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 28 | 4K x 8 | 32KB (32K x 8) | A/D 14x12b | ||
|
|
|
NXP USA Inc. |
598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 2K x 8 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
497
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 1K x 8 | 8KB (8K x 8) | A/D 6x12b | ||
|
|
|
NXP USA Inc. |
757
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 4K x 8 | 32KB (32K x 8) | A/D 12x12b | ||
|
|
|
NXP USA Inc. |
771
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-UFQFN Exposed Pad | 24-QFN (4x4) | 22 | 2K x 8 | 8KB (8K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
327
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 2K x 8 | 16KB (16K x 8) | A/D 6x12b | ||
|
|
|
NXP USA Inc. |
764
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 2K x 8 | 16KB (16K x 8) | A/D 12x12b | ||
|
|
|
NXP USA Inc. |
468
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 28 | 2K x 8 | 16KB (16K x 8) | A/D 14x12b | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 2K x 8 | 16KB (16K x 8) | A/D 7x12b |
