- Operating Temperature：
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- Supplier Device Package：
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Discover 404 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | |
|
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
32QFN IND TEMP，GREEN,1.6-3.6V,4
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
5,020
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32QFN IND TEMP，GREEN,1.6-3.6V,4
|
Cut Tape (CT) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
5,020
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32QFN IND TEMP，GREEN,1.6-3.6V,4
|
- | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
4,500
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64TQFP
|
Tape & Reel (TR) | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 8K x 8 | 64KB (64K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
6,621
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64TQFP
|
Cut Tape (CT) | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 8K x 8 | 64KB (64K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
6,621
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64TQFP
|
- | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 8K x 8 | 64KB (64K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
1,500
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64TQFP
|
Tape & Reel (TR) | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 16K x 8 | 128KB (128K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
3,676
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64TQFP
|
Cut Tape (CT) | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 16K x 8 | 128KB (128K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
3,676
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64TQFP
|
- | SAM D20J | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | 52 | 16K x 8 | 128KB (128K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
27,000
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tape & Reel (TR) | SAM D20J | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | 52 | 32K x 8 | 256KB (256K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
27,873
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Cut Tape (CT) | SAM D20J | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | 52 | 32K x 8 | 256KB (256K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
27,873
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
- | SAM D20J | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | 52 | 32K x 8 | 256KB (256K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
5,174
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | SAM D20J | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | 52 | 32K x 8 | 256KB (256K x 8) | A/D 20x12b，D/A 1x10b | |||
|
|
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Cut Tape (CT) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
- | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32TQFP
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
3,819
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32TQFP
|
Cut Tape (CT) | SAM D20E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
3,819
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32TQFP
|
- | SAM D20E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | 26 | 4K x 8 | 32KB (32K x 8) | A/D 10x12b，D/A 1x10b | |||
|
|
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tape & Reel (TR) | SAM D20E | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 26 | 8K x 8 | 64KB (64K x 8) | A/D 10x12b，D/A 1x10b |
