- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Program Memory Size：
-
- Data Converters：
-
- Selected conditions:
Discover 17 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Program Memory Size | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Program Memory Size | Data Converters | |
|
|
|
NXP USA Inc. |
15,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2x1.61) | 18 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
7,078
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
3,735
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16QFN
|
Tray | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 8KB (8K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
4,614
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
5,223
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 16QFN
|
Tray | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 16QFN
|
Tray | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
771
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | -40°C ~ 105°C (TA) | 24-UFQFN Exposed Pad | 24-QFN (4x4) | 22 | 8KB (8K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 22 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-XFBGA，WLCSP | 20-WLCSP (2x1.61) | - | 32KB (32K x 8) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP | 18 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP | 18 | 32KB (32K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 8KB (8K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | 14 | 16KB (16K x 8) | A/D 7x12b | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 16-WQFN Exposed Pad | 16-QFN (3x3) | 14 | 32KB (32K x 8) | A/D 7x12b |
