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Discover 790 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Microchip Technology |
582
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 100LQFP
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Tray | SAM4E | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 79 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，Ethernet，IrDA，MMC/SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
800
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3 days |
-
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MOQ: 800 MPQ: 1
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IC MCU 32BIT 512KB FLASH 144LQFP
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Tape & Reel (TR) | SAM4E | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 117 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，IrDA，SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
1,139
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 144LQFP
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Cut Tape (CT) | SAM4E | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 117 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，IrDA，SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
1,139
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
- | SAM4E | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 117 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，IrDA，SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
694
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | SAM4E | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 117 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，IrDA，SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
1,487
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 144LQFP
|
Tray | SAM4E | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 117 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，IrDA，SD，SPI，UART/USART，USB | 32-Bit | ||
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Infineon Technologies |
1,120
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
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Tray | XMC4000 | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-19 | DMA，I2S，LED，POR，PWM，WDT | 31 | 80K x 8 | 512KB (512K x 8) | - | 3.13 V ~ 3.63 V | A/D 14x12b; D/A 2x12b | CANbus，Ethernet，I2C，LINbus，SPI，UART，USB | 32-Bit | ||
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Infineon Technologies |
1,734
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 144LQFP
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Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | 144-LQFP (20x20) | DMA，I2S，LED，POR，PWM，WDT | 91 | 160K x 8 | 1MB (1M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，SPI，UART，USB | 32-Bit | ||
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Infineon Technologies |
3,687
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 100LQFP
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Tray | XMC4000 | -40°C ~ 125°C (TA) | 100-LQFP Exposed Pad | PG-LQFP-100-11 | DMA，I2S，LED，POR，PWM，WDT | 55 | 160K x 8 | 1MB (1M x 8) | - | 3.13 V ~ 3.63 V | A/D 24x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，SPI，UART，USB | 32-Bit | ||
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Infineon Technologies |
481
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 144LFBGA
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Tray | XMC4000 | -40°C ~ 105°C (TA) | 144-LFBGA | 144-LFBGA (10x10) | DMA，I2S，LED，POR，PWM，WDT | 91 | 160K x 8 | 1MB (1M x 8) | - | 3.13 V ~ 3.63 V | A/D 32x12b，D/A 2x12b | CANbus，EBI/EMI，Ethernet，I2C，LINbus，SPI，UART，USB | 32-Bit | ||
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Microchip Technology |
988
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | 48 | 176K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | I2C，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
2,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 512KB FLASH 100LQFP
|
Tape & Reel (TR) | SAM4E | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 79 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，Ethernet，IrDA，MMC/SD，SPI，UART/USART，USB | 32-Bit | ||
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Microchip Technology |
2,588
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Cut Tape (CT) | SAM4E | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 79 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，Ethernet，IrDA，MMC/SD，SPI，UART/USART，USB | 32-Bit | ||
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|
|
Microchip Technology |
2,588
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
- | SAM4E | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 79 | 128K x 8 | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，Ethernet，IrDA，MMC/SD，SPI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
14,649
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，LVD，POR，PWM，WDT | 40 | 128K x 8 | 512KB (512K x 8) | - | 1.71 V ~ 3.6 V | A/D 22x16b，D/A 2x12b | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
1,613
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，I2S，LVD，POR，PWM，WDT | 66 | 48K x 8 | 256KB (256K x 8) | - | 1.71 V ~ 3.6 V | A/D 33x16b，D/A 1x12b | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
4,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 121MAPBGA
|
Tape & Reel (TR) | Kinetis K20 | -40°C ~ 105°C (TA) | 121-XFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | 83 | 256K x 8 | 1MB (1M x 8) | - | 1.71 V ~ 3.6 V | A/D 37x16b，D/A 2x12b | CANbus，EBI/EMI，I2C，IrDA，SD，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
4,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 121MAPBGA
|
Cut Tape (CT) | Kinetis K20 | -40°C ~ 105°C (TA) | 121-XFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | 83 | 256K x 8 | 1MB (1M x 8) | - | 1.71 V ~ 3.6 V | A/D 37x16b，D/A 2x12b | CANbus，EBI/EMI，I2C，IrDA，SD，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
4,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 121MAPBGA
|
- | Kinetis K20 | -40°C ~ 105°C (TA) | 121-XFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | 83 | 256K x 8 | 1MB (1M x 8) | - | 1.71 V ~ 3.6 V | A/D 37x16b，D/A 2x12b | CANbus，EBI/EMI，I2C，IrDA，SD，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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Infineon Technologies |
247
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 100-LQFP Exposed Pad | PG-LQFP-100-25 | DMA，I2S，LED，POR，PWM，WDT | 55 | 80K x 8 | 512KB (512K x 8) | - | 3.13 V ~ 3.63 V | A/D 24x12b，D/A 2x12b | CANbus，Ethernet，I2C，LINbus，SPI，UART，USB | 32-Bit |
