- Packaging：
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- Operating Temperature：
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- Supplier Device Package：
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- RAM Size：
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Discover 12 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | |
|
|
|
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (2.55x2.55) | 18 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | 16KB (16K x 8) | 1K x 8 | ||
|
|
|
NXP USA Inc. |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 48LQFP
|
Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 4K x 8 | 16KB (16K x 8) | 1K x 8 | ||
|
|
|
NXP USA Inc. |
457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 24KB (24K x 8) | 2K x 8 | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
213
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 8K x 8 | 32KB (32K x 8) | 4K x 8 | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20WLCSP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | - | 18 | 4K x 8 | 16KB (16K x 8) | 2K x 8 | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 33HVQFN
|
Tray | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 2K x 8 | 8KB (8K x 8) | 512 x 8 | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 24KB (24K x 8) | 2K x 8 | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 8K x 8 | 32KB (32K x 8) | 4K x 8 |
