- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- RAM Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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Discover 20 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
4,771
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC11Exx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 40 | 8K x 8 | 2K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART | ||
|
|
|
NXP USA Inc. |
742
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 40 | 8K x 8 | 1K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
240
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC1100XL | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC11Axx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 2K x 8 | 2.6 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART | ||
|
|
|
NXP USA Inc. |
55
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
229
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
474
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 40 | 6K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，Microwire，SmartCard，SPI，SSP，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 48LQFP
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 42 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tape & Reel (TR) | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tape & Reel (TR) | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | - | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100XL | -40°C ~ 105°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100L | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100XL | -40°C ~ 105°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC1100 | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 28 | 4K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | I2C，SPI，UART/USART | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 32BIT 24KB FLASH 33HVQFN
|
Tray | LPC11Axx | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 28 | 6K x 8 | 2K x 8 | 2.6 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | I2C，Microwire，SPI，SSI，SSP，UART/USART |
