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Discover 105 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
22,033
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
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Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 40 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，TSI，UART/USART | ||
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NXP USA Inc. |
4,940
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
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Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 36 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
2,340
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
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Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 36 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 13x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
1,295
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
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Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 40 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 15x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，TSI，UART/USART | ||
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Microchip Technology |
183
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tray | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 3500 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tape & Reel (TR) | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Microchip Technology |
3,924
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Cut Tape (CT) | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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- | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Microchip Technology |
45
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tray | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Nuvoton Technology Corporation of America |
Inquiry
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- |
-
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MOQ: 416 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tray | NuMicro Nano100 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M0 | 38 | 42MHz | 64KB (64K x 8) | 1.8 V ~ 3.6 V | A/D 7x12b，D/A 2x12b | Internal | EBI/EMI，I2C，SPI，UART/USART | ||
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Nuvoton Technology Corporation of America |
Inquiry
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- |
-
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MOQ: 416 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
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Tray | NuMicro Nano100 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M0 | 38 | 42MHz | 128KB (128K x 8) | 1.8 V ~ 3.6 V | A/D 7x12b，D/A 2x12b | Internal | EBI/EMI，I2C，SPI，UART/USART | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 416 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tray | AVR32 UC3 L | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，PWM，WDT | AVR | 36 | 50MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 4000 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
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Tape & Reel (TR) | AVR32 UC3 L | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，PWM，WDT | AVR | 36 | 50MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Cut Tape (CT) | AVR32 UC3 L | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，PWM，WDT | AVR | 36 | 50MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
- | AVR32 UC3 L | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，PWM，WDT | AVR | 36 | 50MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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KINETIS KL16: 48MHZ CORTEX-M0+ U
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Tape & Reel (TR) | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 40 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，TSI，UART/USART | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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KINETIS KL26: 48MHZ CORTEX-M0+ U
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Tape & Reel (TR) | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 36 | 48MHz | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 780 MPQ: 1
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IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | SAM3N | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，PWM，WDT | ARM Cortex-M3 | 34 | 48MHz | 128KB (128K x 8) | 1.62 V ~ 3.6 V | A/D 8x10b | Internal | I2C，IrDA，SPI，UART/USART | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 3500 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tape & Reel (TR) | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48QFN
|
Cut Tape (CT) | SAM3S | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | ARM Cortex-M3 | 34 | 64MHz | 64KB (64K x 8) | 1.62 V ~ 3.6 V | A/D 8x10/12b | Internal | I2C，MMC，SPI，SSC，UART/USART，USB |
