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Discover 41 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Silicon Labs |
3,939
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 24QFN
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Tube | C8051F9xx | -40°C ~ 85°C (TA) | 24-WFQFN Exposed Pad | CapSense，DMA，POR，PWM，WDT | CIP-51 | 19 | 25MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 19x10b | I2C/SMBus，I2C Slave，SPI，UART/USART | 8-Bit | ||
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NXP USA Inc. |
14,126
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
4,876
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b，D/A 1x12b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
757
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C，SPI，UART/USART | 32-Bit | ||
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Silicon Labs |
Inquiry
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- |
-
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MOQ: 1500 MPQ: 1
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IC MCU 8BIT 16KB FLASH 24QFN
|
Tape & Reel (TR) | C8051F9xx | -40°C ~ 85°C (TA) | 24-WFQFN Exposed Pad | CapSense，DMA，POR，PWM，WDT | CIP-51 | 19 | 25MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 19x10b | I2C/SMBus，I2C Slave，SPI，UART/USART | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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KINETIS KL04: 48MHZ CORTEX-M0+ U
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Tape & Reel (TR) | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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KINETIS KL05: 48MHZ CORTEX-M0+ U
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Tape & Reel (TR) | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b，D/A 1x12b | I2C，SPI，UART/USART | 32-Bit | ||
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Microchip Technology |
6,000
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3 days |
-
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MOQ: 6000 MPQ: 1
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IC MCU 32BIT 16KB FLASH 24QFN
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Tape & Reel (TR) | SAM D09D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
9,477
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 24QFN
|
Cut Tape (CT) | SAM D09D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
9,477
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
- | SAM D09D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
6,000
|
3 days |
-
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MOQ: 6000 MPQ: 1
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IC MCU 32BIT 16KB FLASH 24QFN
|
Tape & Reel (TR) | SAM D10D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 1x10b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
6,064
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 24QFN
|
Cut Tape (CT) | SAM D10D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 1x10b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
6,064
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
- | SAM D10D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 16KB (16K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 1x10b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
1,820
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
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Tray | PSOC 4 CY8C4000S | -40°C ~ 85°C (TA) | 24-UFQFN Exposed Pad | Brown-out Detect/Reset，CapSense，LCD，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 19 | 24MHz | 32KB (32K x 8) | 1.71 V ~ 5.5 V | A/D 1x10b | I2C，IrDA，LINbus，Microwire，SmartCard，SPI，SSP，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
1,080
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | PSOC 4 CY8C4000S | -40°C ~ 85°C (TA) | 24-UFQFN Exposed Pad | Brown-out Detect/Reset，CapSense，LCD，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 19 | 24MHz | 32KB (32K x 8) | 1.71 V ~ 5.5 V | A/D 1x10b | I2C，IrDA，LINbus，Microwire，SmartCard，SPI，SSP，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
418
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | PSOC 4 CY8C4000S | -40°C ~ 85°C (TA) | 24-UFQFN Exposed Pad | Brown-out Detect/Reset，CapSense，LCD，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 19 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 5.5 V | A/D 1x10b | I2C，IrDA，LINbus，Microwire，SmartCard，SPI，SSP，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
391
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | PSOC 4 CY8C4700S | -40°C ~ 85°C (TA) | 24-UFQFN Exposed Pad | Brown-out Detect/Reset，CapSense，LCD，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 19 | 48MHz | 32KB (32K x 8) | 1.71 V ~ 5.5 V | A/D 16x10b | I2C，IrDA，LINbus，Microwire，SmartCard，SPI，SSP，UART/USART | 32-Bit | |||
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Microchip Technology |
4,211
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8KB FLASH 24QFN
|
Cut Tape (CT) | SAM D10D | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 8KB (8K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 1x10b | I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Microchip Technology |
7,047
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8KB FLASH 24QFN
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Cut Tape (CT) | SAM D10D | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset，DMA，POR，WDT | ARM Cortex-M0+ | 22 | 48MHz | 8KB (8K x 8) | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 1x10b | I2C，LINbus，SPI，UART/USART | 32-Bit |
