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Discover 54 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
7,078
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 7x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
14,126
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
4,614
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 16KB (16K x 8) | 1.71 V ~ 3.6 V | A/D 7x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
4,876
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b,D/A 1x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
4,197
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 12x12b | I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
489
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 16KB (16K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
757
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
771
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-UFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 8KB (8K x 8) | 1.71 V ~ 3.6 V | A/D 7x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
764
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 16KB (16K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
880
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 8KB (8K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
Silicon Labs |
273
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
8051 8-BIT MCU,FULL SPEED USB
|
Tube | Universal Bee | -40°C ~ 85°C (TA) | 24-WFQFN Exposed Pad | Brown-out Detect/Reset,POR,PWM,WDT | CIP-51 8051 | 17 | 3.25K x 8 | 40KB (40K x 8) | 1.71 V ~ 5.5 V | A/D 16x12b | I2C,SMBus,SPI,UART/USART,USB | 8-Bit | ||||
NXP USA Inc. |
211
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 8KB (8K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b,D/A 1x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
319
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 16KB (16K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b,D/A 1x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 16KB (16K x 8) | 1.71 V ~ 3.6 V | A/D 7x12b | I2C,SPI,UART/USART | 32-Bit | ||||
Silicon Labs |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
FULL SPEED USB,40KB FLASH
|
Tape & Reel (TR) | Universal Bee | -40°C ~ 85°C (TA) | 24-WFQFN Exposed Pad | Brown-out Detect/Reset,POR,PWM,WDT | CIP-51 8051 | 17 | 3.25K x 8 | 40KB (40K x 8) | 1.71 V ~ 5.5 V | A/D 16x12b | I2C,SMBus,SPI,UART/USART,USB | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | LVD,PWM,WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 12x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2450 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KEA | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 1K x 8 | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 12x12b | I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 2K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 7x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL04: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | Brown-out Detect/Reset,DMA,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 22 | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 12x12b | I2C,SPI,UART/USART | 32-Bit |