- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- RAM Size：
-
- Program Memory Size：
-
- EEPROM Size：
-
- Data Converters：
-
- Connectivity：
-
Discover 20 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
|
|
|
Microchip Technology |
512
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 1.75KB FLASH 8UDFN
|
Tube | PIC 12F | -40°C ~ 125°C (TA) | 8-UDFN Exposed Pad | 6 | 128 x 8 | 1.75KB (1K x 14) | - | A/D 4x10b，D/A 1x5b | - | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 1.75KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 128 x 8 | 1.75KB (1K x 14) | - | A/D 4x10b，D/A 1x5b | - | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | - | A/D 4x10b，D/A 1x5b | LINbus，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1200 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC 12F | -40°C ~ 125°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | - | A/D 4x10b，D/A 1x5b | LINbus，UART/USART | ||
|
|
|
Microchip Technology |
10
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 1.75KB FLASH 8UDFN
|
Tube | PIC 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 128 x 8 | 1.75KB (1K x 14) | - | A/D 4x10b，D/A 1x5b | - | ||
|
|
|
Microchip Technology |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC 12F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | - | A/D 4x10b，D/A 1x5b | LINbus，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 960 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 125°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | ||
|
|
Microchip Technology |
1,041
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 224 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,079
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 125°C (TA) | 8-VDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 224 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 224 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,109
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Cut Tape (CT) | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 224 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,109
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
- | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 224 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
2,070
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Cut Tape (CT) | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
2,070
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
- | PIC 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 6 | 128 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
Tape & Reel (TR) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
2,057
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
Cut Tape (CT) | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 7KB FLASH 8UDFN
|
- | PIC XLP 12F | -40°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 5 | 256 x 8 | 7KB (4K x 14) | 256 x 8 | A/D 4x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
860
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 3.5KB FLASH 8UDFN
|
Tube | PIC XLP 16F | -40°C ~ 85°C (TA) | 8-UDFN Exposed Pad | 6 | 256 x 8 | 3.5KB (2K x 14) | 256 x 8 | A/D 5x10b，D/A 1x5b | I2C，LINbus，SPI，UART/USART |
