- Packaging：
-
- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Peripherals：
-
- Core Processor：
-
- Speed：
-
- EEPROM Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Connectivity：
-
- Core Size：
-
Discover 11 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | Core Size | |
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 8BIT 96KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | - | 1.8 V ~ 3.6 V | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | CANbus，SCI，SPI | 16-Bit |
