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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
278
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | - | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
|
|
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NXP USA Inc. |
1,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | MCF51CN | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | Coldfire V1 | 38 | 50MHz | 24K x 8 | - | 1.8 V ~ 3.6 V | A/D 12x12b | External | Ethernet，I2C，SCI，SPI | 32-Bit | ||
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|
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NXP USA Inc. |
110
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
|
|
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NXP USA Inc. |
144
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
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NXP USA Inc. |
632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
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NXP USA Inc. |
6
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 8K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
16-BIT MCU S12 CORE 128KB FLAS
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Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit |
