- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Core Processor:
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- RAM Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Connectivity:
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- Core Size:
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Discover 38 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA,I2S,LVD,POR,PWM,WDT | ARM Cortex-M4 | 33 | 50MHz | 8K x 8 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C,IrDA,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1,479
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 38 | 40MHz | 2K x 8 | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
1,150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 39 | 40MHz | 2K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA,I2S,LVD,POR,PWM,WDT | ARM Cortex-M4 | 33 | 50MHz | 8K x 8 | - | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C,IrDA,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA,I2S,LVD,POR,PWM,WDT | ARM Cortex-M4 | 29 | 50MHz | 8K x 8 | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C,IrDA,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA,I2S,LVD,POR,PWM,WDT | ARM Cortex-M4 | 29 | 50MHz | 8K x 8 | 2K x 8 | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C,IrDA,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
185
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,PWM,WDT | S08 | 38 | 50MHz | 2K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
283
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 37 | 48MHz | 2K x 8 | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C,LINbus,SCI,SPI,USB | 8-Bit | ||||
NXP USA Inc. |
486
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 38 | 40MHz | 2K x 8 | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | HCS12 | 34 | 32MHz | 2K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | HCS12 | 34 | 32MHz | 2K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | Internal | IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | Internal | IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | 12V1 | 40 | 25MHz | 2K x 8 | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | Internal | IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | HCS12 | 34 | 32MHz | 2K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | HCS12 | 34 | 32MHz | 2K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 38 | 40MHz | 2K x 8 | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD,POR,PWM,WDT | HCS12 | 34 | 32MHz | 2K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD,POR,PWM,WDT | S08 | 39 | 40MHz | 2K x 8 | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | HC08 | 0°C ~ 70°C (TA) | 48-VFQFN Exposed Pad | LED,LVD,POR,PWM | HC08 | 29 | 8MHz | 1K x 8 | - | 3.5 V ~ 5.5 V | - | Internal | SPI,USB | 8-Bit |