Discover 38 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Peripherals Core Processor Number of I/O Speed RAM Size EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Connectivity Core Size
MK10DX32VFT5
NXP USA Inc.
1,200
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48QFN
Tray Kinetis K10 -40°C ~ 105°C (TA) 48-VFQFN Exposed Pad DMA,I2S,LVD,POR,PWM,WDT ARM Cortex-M4 33 50MHz 8K x 8 2K x 8 1.71 V ~ 3.6 V A/D 16x16b Internal I2C,IrDA,SPI,UART/USART 32-Bit
MC9S08AC32CFDE
NXP USA Inc.
1,479
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 38 40MHz 2K x 8 - 2.7 V ~ 5.5 V A/D 8x10b Internal I2C,SCI,SPI 8-Bit
MC9S08GT32ACFDE
NXP USA Inc.
1,150
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 39 40MHz 2K x 8 - 1.8 V ~ 3.6 V A/D 8x10b Internal I2C,SCI,SPI 8-Bit
MK10DN32VFT5
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48QFN
Tray Kinetis K10 -40°C ~ 105°C (TA) 48-VFQFN Exposed Pad DMA,I2S,LVD,POR,PWM,WDT ARM Cortex-M4 33 50MHz 8K x 8 - 1.71 V ~ 3.6 V A/D 16x16b Internal I2C,IrDA,SPI,UART/USART 32-Bit
MK20DN32VFT5
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48QFN
Tray Kinetis K20 -40°C ~ 105°C (TA) 48-VFQFN Exposed Pad DMA,I2S,LVD,POR,PWM,WDT ARM Cortex-M4 29 50MHz 8K x 8 - 1.71 V ~ 3.6 V A/D 11x16b Internal I2C,IrDA,SPI,UART/USART,USB,USB OTG 32-Bit
MK20DX32VFT5
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48QFN
Tray Kinetis K20 -40°C ~ 105°C (TA) 48-VFQFN Exposed Pad DMA,I2S,LVD,POR,PWM,WDT ARM Cortex-M4 29 50MHz 8K x 8 2K x 8 1.71 V ~ 3.6 V A/D 11x16b Internal I2C,IrDA,SPI,UART/USART,USB,USB OTG 32-Bit
MC9S08QE32CFT
NXP USA Inc.
185
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,PWM,WDT S08 38 50MHz 2K x 8 - 1.8 V ~ 3.6 V A/D 10x12b Internal I2C,LINbus,SCI,SPI 8-Bit
MC9S08JM32CGT
NXP USA Inc.
283
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 37 48MHz 2K x 8 - 2.7 V ~ 5.5 V A/D 8x12b External I2C,LINbus,SCI,SPI,USB 8-Bit
MC9S08AW32CFDE
NXP USA Inc.
486
3 days
-
MOQ: 1  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 38 40MHz 2K x 8 - 2.7 V ~ 5.5 V A/D 8x10b Internal I2C,SCI,SPI 8-Bit
S9S12P32J0VFTR
NXP USA Inc.
Inquiry
-
-
MOQ: 2000  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tape & Reel (TR) HCS12 -40°C ~ 105°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT HCS12 34 32MHz 2K x 8 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
S9S12P32J0VFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 105°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT HCS12 34 32MHz 2K x 8 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
S9S12GN32F0CFTR
NXP USA Inc.
Inquiry
-
-
MOQ: 2000  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tape & Reel (TR) HCS12 -40°C ~ 85°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT 12V1 40 25MHz 2K x 8 1K x 8 3.13 V ~ 5.5 V A/D 8x10b Internal IrDA,LINbus,SCI,SPI 16-Bit
S9S12GN32F0CFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 85°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT 12V1 40 25MHz 2K x 8 1K x 8 3.13 V ~ 5.5 V A/D 8x10b Internal IrDA,LINbus,SCI,SPI 16-Bit
S9S12GN32F0MFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 125°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT 12V1 40 25MHz 2K x 8 1K x 8 3.13 V ~ 5.5 V A/D 8x10b Internal IrDA,LINbus,SCI,SPI 16-Bit
S9S12P32J0CFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 85°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT HCS12 34 32MHz 2K x 8 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
S9S12P32J0MFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 125°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT HCS12 34 32MHz 2K x 8 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
S9S08AW32E5CFDE
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 38 40MHz 2K x 8 - 2.7 V ~ 5.5 V A/D 8x10b Internal I2C,SCI,SPI 8-Bit
MC9S12P32CFT
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 16BIT 32KB FLASH 48QFN
Tray HCS12 -40°C ~ 85°C (TA) 48-TFQFN Exposed Pad LVD,POR,PWM,WDT HCS12 34 32MHz 2K x 8 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
MC9S08GT32ACFDER
NXP USA Inc.
Inquiry
-
-
MOQ: 2000  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tape & Reel (TR) S08 -40°C ~ 85°C (TA) 48-VFQFN Exposed Pad LVD,POR,PWM,WDT S08 39 40MHz 2K x 8 - 1.8 V ~ 3.6 V A/D 8x10b Internal I2C,SCI,SPI 8-Bit
MCHC908JW32FC
NXP USA Inc.
Inquiry
-
-
MOQ: 1300  MPQ: 1
IC MCU 8BIT 32KB FLASH 48QFN
Tray HC08 0°C ~ 70°C (TA) 48-VFQFN Exposed Pad LED,LVD,POR,PWM HC08 29 8MHz 1K x 8 - 3.5 V ~ 5.5 V - Internal SPI,USB 8-Bit