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Discover 95 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
4,680
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
- | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,479
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 38 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
1,150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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|
|
NXP USA Inc. |
283
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 37 | 48MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
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NXP USA Inc. |
2,569
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 37 | 48MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
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|
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NXP USA Inc. |
846
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 38 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
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NXP USA Inc. |
497
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 37 | 48MHz | 4K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
486
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 38 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
321
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
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NXP USA Inc. |
785
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | HCS12 | 34 | 32MHz | 4K x 8 | 64KB (64K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
47
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 38 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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|
NXP USA Inc. |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | HCS12 | 34 | 32MHz | 2K x 8 | 32KB (32K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | S08 | 39 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | HCS12 | 34 | 32MHz | 2K x 8 | 32KB (32K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit |
