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Discover 170 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
19,692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 32KB (32K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
3,750
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tape & Reel (TR) | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM | HC08 | 33 | 8MHz | 512 x 8 | 32KB (32K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
3,982
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Cut Tape (CT) | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM | HC08 | 33 | 8MHz | 512 x 8 | 32KB (32K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
3,982
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
- | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM | HC08 | 33 | 8MHz | 512 x 8 | 32KB (32K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
344
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 4K x 8 | 60KB (60K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
1,130
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LED,LVD,POR,PWM | HC08 | 32 | 8MHz | 2K x 8 | 64KB (64K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x10b | I2C,IRSCI,SCI,SPI | ||||
NXP USA Inc. |
1,387
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM | HC08 | 33 | 8MHz | 512 x 8 | 32KB (32K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x8b | SCI,SPI | ||||
NXP USA Inc. |
750
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 1K x 8 | 8KB (8K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 1K x 8 | 8KB (8K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
- | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 1K x 8 | 8KB (8K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,250
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
2,587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
- | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
717
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LED,LVD,POR,PWM | HC08 | 32 | 8MHz | 2K x 8 | 32KB (32K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x10b | I2C,IRSCI,SCI,SPI | ||||
NXP USA Inc. |
1,778
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 1K x 8 | 8KB (8K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
824
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tray | HC08 | 0°C ~ 70°C (TA) | 44-QFP (10x10) | LVD,POR,PWM | HC08 | 37 | 3MHz | 256 x 8 | 8KB (8K x 8) | Flash | 4 V ~ 5.5 V | - | USB | ||||
NXP USA Inc. |
1,418
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 125°C (TA) | 44-QFP (10x10) | LVD,POR,PWM,WDT | S08 | 36 | 40MHz | 2K x 8 | 16KB (16K x 8) | Flash | 1.8 V ~ 3.6 V | A/D 8x10b | I2C,SCI,SPI | ||||
NXP USA Inc. |
524
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LED,LVD,POR,PWM | HC08 | 32 | 8MHz | 1K x 8 | 8KB (8K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x10b | I2C,IRSCI,SCI,SPI | ||||
NXP USA Inc. |
334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP (10x10) | LED,LVD,POR,PWM | HC08 | 32 | 8MHz | 1K x 8 | 16KB (16K x 8) | Flash | 2.7 V ~ 5.5 V | A/D 8x10b | I2C,IRSCI,SCI,SPI |