- Packaging:
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- Operating Temperature:
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- Core Processor:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Connectivity:
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- Core Size:
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- Selected conditions:
Discover 147 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 48MHz | 16K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 33x12b | CANbus,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 24K x 8 | 256KB (256K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 20K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 16x10b | CANbus,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 384KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 68 | 64MHz | 36K x 8 | 384KB (384K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 30x10b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1,317
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 32K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 68 | 64MHz | 40K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 30x10b | CANbus,FlexRay,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
435
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 77 | 64MHz | 64K x 8 | 768KB (768K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
65
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 32K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | e200z0h | 77 | 64MHz | 64K x 8 | 768KB (768K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 77 | 64MHz | 64K x 8 | 768KB (768K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 105°C (TA) | e200z0h | 77 | 64MHz | 80K x 8 | 1MB (1M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 100LQFP
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | e200z0h | 77 | 64MHz | 64K x 8 | 768KB (768K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | -40°C ~ 105°C (TA) | e200z0h | 79 | 48MHz | 16K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 33x12b | CANbus,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 85°C (TA) | e200z0h | 79 | 48MHz | 28K x 8 | 384KB (384K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | e200z0h | 77 | 64MHz | 80K x 8 | 1MB (1M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | -40°C ~ 85°C (TA) | e200z0h | 79 | 64MHz | 32K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 32K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100LQFP
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 79 | 64MHz | 48K x 8 | 512KB (512K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 28x10b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | -40°C ~ 125°C (TA) | e200z0h | 77 | 64MHz | 80K x 8 | 1MB (1M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 7x10b,5x12b | CANbus,I2C,LINbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | e200z0h | 79 | 32MHz | 16K x 8 | 256KB (256K x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 33x12b | CANbus,LINbus,SCI,SPI | 32-Bit |