- Packaging:
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- Core Processor:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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Discover 41 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
2,698
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
661
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
761
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
798
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 1K x 8 | 16KB (16K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | POR,PWM,WDT | HCS12 | 35 | 16MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 96KB (96K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 8BIT ROMLESS 52LQFP
|
Tray | HC11 | -40°C ~ 85°C (TA) | POR,WDT | HC11 | 38 | 2MHz | 512 x 8 | - | ROMless | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 8BIT 12KB FLASH 52LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | LCD,LVD,POR,PWM | HC08 | 20 | 8MHz | 512 x 8 | 12KB (12K x 8) | Flash | - | 3 V ~ 5.5 V | A/D 4x10b | IRSCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MCU 8BIT 12KB FLASH 52LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | LCD,LVD,POR,PWM | HC08 | 20 | 8MHz | 512 x 8 | 12KB (12K x 8) | Flash | - | 3 V ~ 5.5 V | A/D 4x10b | IRSCI,SPI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 52LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | LCD,LVD,POR,PWM | HC08 | 40 | 8MHz | 512 x 8 | 8KB (8K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 6x10b | - | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 52LQFP
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 52LQFP
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | CANbus,EBI/EMI,SCI,SPI | 16-Bit |