- Packaging：
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- Operating Temperature：
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- Speed：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Connectivity：
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Discover 17 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | Number of I/O | Speed | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Core Processor | Number of I/O | Speed | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48QFN
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 105°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 85°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 125°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 85°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 125°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 85°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tray | -40°C ~ 125°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | ||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | -40°C ~ 125°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | |||
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NXP USA Inc. |
2,000
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3 days |
-
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MOQ: 2000 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
16-BIT,32K FLASH,2K RAM
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Tape & Reel (TR) | -40°C ~ 85°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | |||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
16-BIT,32K FLASH,2K RAM
|
Tray | -40°C ~ 85°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | |||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tray | -40°C ~ 105°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI | |||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
16-BIT MCU S12 CORE 32KB FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | HCS12 | 34 | 32MHz | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | CANbus，SCI，SPI | |||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
16-BIT32K FLASH2K RAM
|
Tray | -40°C ~ 105°C (TA) | 12V1 | 40 | 25MHz | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | IrDA，LINbus，SCI，SPI |
