- Manufacturer:
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- Packaging:
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- Operating Temperature:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- RAM Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Selected conditions:
Discover 21 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
622
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 144MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 80MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | 32 | 200MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
3M FLASH 256K RAM Z7 200MHZ
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | 32 | 200MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 80MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | 32 | 200MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
3M FLASH 256K RAM Z7 200MHZ
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | 32 | 200MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 112MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | 32 | 264MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC55xx Qorivva | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 144MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 144MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z6 | 256 | 144MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus,EBI/EMI,Ethernet,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tray | PX | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA,POR,PWM,WDT | e200z7 | 198 | 264MHz | 192K x 8 | - | 3 V ~ 5.5 V | A/D 64x12b | Internal | CANbus,EBI/EMI,LINbus,SCI,SPI,UART/USART | ||||
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | PG-BGA-416-10 | DMA,POR,WDT | TriCore | 221 | 150MHz | 224K x 8 | 64K x 8 | 1.42 V ~ 1.58 V | A/D 4x10b,44x12b | External | ASC,CANbus,EBI/EMI,FlexRay,MLI,MSC,SSC |