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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
194
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 200MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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3M FLASH 256K RAM Z7 200MHZ
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 200MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 200MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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3M FLASH 256K RAM Z7 200MHZ
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 200MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | - | 180MHz | 384K x 8 | 6MB (6M x 8) | 1.14 V ~ 1.32 V | A/D 64x12b | Internal | CANbus，EBI/EMI，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 6MB FLASH 416BGA
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | - | 180MHz | 384K x 8 | 6MB (6M x 8) | 1.14 V ~ 1.32 V | A/D 64x12b | Internal | CANbus，EBI/EMI，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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4M FLASH 256K RAM Z7 264MHZ
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Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM | e200z7 | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
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Tray | -40°C ~ 85°C (TA) | DMA，POR，PWM，WDT | e200z4d | 177 | 125MHz | 1.064M x 8 | 2MB (2M x 8) | 3 V ~ 5.5 V | A/D 20x10b | Internal | CANbus，I2C，LINbus，SCI，SPI | 32-Bit |
