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Discover 111 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
888
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
1,260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
575
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 16K x 8 | 256KB (256K x 8) | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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|
|
NXP USA Inc. |
361
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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|
|
NXP USA Inc. |
413
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
718
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
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NXP USA Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
285
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
284
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
405
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 14K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 32K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
519
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
366
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus，I2C，SCI，SPI | ||
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|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12 | 64 | 32MHz | 4K x 8 | 64KB (64K x 8) | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12 | 64 | 32MHz | 6K x 8 | 128KB (128K x 8) | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 16K x 8 | 256KB (256K x 8) | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 16K x 8 | 256KB (256K x 8) | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
|
|
|
NXP USA Inc. |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM，WDT | HCS12 | 59 | 25MHz | 12K x 8 | 256KB (256K x 8) | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI |
