- Packaging:
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- Series:
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- Operating Temperature:
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- Peripherals:
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- Core Processor:
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- Speed:
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- RAM Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Selected conditions:
Discover 66 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
1,260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 16K x 8 | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
575
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 50MHz | 16K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
718
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
285
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
284
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 16K x 8 | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
405
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 14K x 8 | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
366
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 50MHz | 16K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 50MHz | 16K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | PWM,WDT | HCS12 | 59 | 25MHz | 12K x 8 | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
4
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 16K x 8 | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 750 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | HCS12X | -40°C ~ 105°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 50MHz | 16K x 8 | 4K x 8 | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 750 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | HCS12X | -40°C ~ 85°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tape & Reel (TR) | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD,POR,PWM,WDT | HCS12X | 59 | 40MHz | 12K x 8 | - | 1.72 V ~ 5.5 V | A/D 8x12b | External | CANbus,SCI,SPI |