- Manufacturer:
-
- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Speed:
-
- RAM Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Oscillator Type:
-
- Connectivity:
-
- Core Size:
-
- Selected conditions:
Discover 7 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
407
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM926EJ-S | - | 180MHz | 192K x 8 | 1.1 V ~ 3.6 V | A/D 4x10b | External | EBI/EMI,I2C,Memory Card,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
NXP USA Inc. |
52
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM926EJ-S | - | 180MHz | 96K x 8 | 1.1 V ~ 3.6 V | A/D 4x10b | External | EBI/EMI,I2C,Memory Card,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
NXP USA Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM926EJ-S | 20 | 270MHz | 192K x 8 | 1.1 V ~ 3.6 V | A/D 4x10b | External | EBI/EMI,I2C,IrDA,Memory Card,PCM,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 189 MPQ: 1
|
IC MCU 32BIT ROMLESS 208TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (12x12) | ARM9 | 10 | 180MHz | 192K x 8 | 1.1 V ~ 3.6 V | A/D 3x10b | External | EBI/EMI,I2C,IrDA,Memory Card,PCM,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 189 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM926EJ-S | 20 | 270MHz | 192K x 8 | 1.1 V ~ 3.6 V | A/D 4x10b | External | EBI/EMI,I2C,IrDA,Memory Card,PCM,SPI,UART/USART,USB OTG | 16/32-Bit | ||||
Maxim Integrated |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LBGA
|
- | DeepCover | - | - | - | ARM926EJ-S | 160 | 400MHz | 384K x 8 | - | A/D 3x10b | - | EBI/EMI,Ethernet,I2C,SD/SDHC/SDIO,SmartCard,SPI,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 189 MPQ: 1
|
IC MCU 32BIT ROMLESS 208TFBGA
|
Tray | LPC3100 | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (12x12) | ARM9 | 10 | 180MHz | 192K x 8 | 1.1 V ~ 3.6 V | A/D 3x10b | External | EBI/EMI,I2C,IrDA,Memory Card,PCM,SPI,UART/USART,USB OTG | 16/32-Bit |