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- Supplier Device Package:
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- Core Processor:
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Discover 12 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
1,399
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 144LQFP
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | ARM Cortex-M4/M0 | 83 | 204MHz | 200K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
590
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM Cortex-M4/M0 | 118 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
775
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 144LQFP
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | ARM Cortex-M4/M0 | 83 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
180
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | ARM Cortex-M4/M0 | 164 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC18xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M3 | 64 | 150MHz | 168K x 8 | 2 V ~ 3.6 V | A/D 12x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,Microwire,SPI,SSI,SSP,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
64
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 144LQFP
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | ARM Cortex-M4/M0 | 83 | 204MHz | 200K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | ARM Cortex-M4/M0 | 164 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 144LQFP
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | ARM Cortex-M4/M0 | 83 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tape & Reel (TR) | LPC43xx | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM Cortex-M4/M0 | 118 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC18xx | -40°C ~ 85°C | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M3 | 64 | 150MHz | 136K x 8 | 2 V ~ 3.6 V | A/D 12x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,Microwire,SPI,SSI,SSP,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 189 MPQ: 1
|
IC MCU 32BIT ROMLESS 180TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | ARM Cortex-M4/M0 | 118 | 204MHz | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MCU 32BIT ROMLESS 144LQFP
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | ARM Cortex-M4/M0 | 83 | 204MHz | 168K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | 32-Bit Dual-Core |