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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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NXP USA Inc. |
5,725
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 32LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 26 | 50MHz | 1K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,137
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 32LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 40MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
2,550
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 32QFN
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | ARM Cortex-M0+ | 28 | 40MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
1,793
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 32LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 20MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
455
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 32SDIP
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Tube | S08 | -40°C ~ 85°C (TA) | 32-SDIP (0.400"，10.16mm) | 32-SDIP | S08 | 30 | 20MHz | 1K x 8 | - | 4.5 V ~ 5.5 V | A/D 12x8b | SCI | 8-Bit | ||
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NXP USA Inc. |
435
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 28SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | S08 | 22 | 50MHz | 1K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,057
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 44LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 44-LQFP | 44-LQFP (10x10) | S08 | 34 | 50MHz | 1K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
2,228
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 32LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 30 | 20MHz | 1K x 8 | - | 4.5 V ~ 5.5 V | A/D 12x8b | SCI | 8-Bit | ||
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NXP USA Inc. |
2,877
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 38 | 50MHz | 1K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
245
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 44LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 20MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
82
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB FLASH 44LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 40MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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KINETIS KE02: 20MHZ CORTEX-M0+ 5
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Tape & Reel (TR) | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 20MHz | 2K x 8 | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2450 MPQ: 1
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S08QE 8-BIT MCU S08 CORE 16KB
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Tray | S08 | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S08 | 26 | 50MHz | 1K x 8 | - | 1.8 V ~ 3.6 V | A/D 10x12b | I2C，LINbus，SCI，SPI | 8-Bit |
