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Discover 22 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
1,982
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,952
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16SOP
|
Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | ARM Cortex-M0+ | 14 | 48MHz | 1K x 8 | 2.7 V ~ 5.5 V | A/D 6x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
288
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 32LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 26 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,083
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 20SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | S08 | 16 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,530
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 32LQFP
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Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 30 | 20MHz | 768 x 8 | 4.5 V ~ 5.5 V | A/D 12x8b | Internal | SCI | 8-Bit | ||
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NXP USA Inc. |
1,586
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 32SDIP
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Tube | S08 | -40°C ~ 85°C (TA) | 32-SDIP (0.400"，10.16mm) | 32-SDIP | S08 | 30 | 20MHz | 768 x 8 | 4.5 V ~ 5.5 V | A/D 12x8b | Internal | SCI | 8-Bit | ||
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NXP USA Inc. |
625
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16DIP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-DIP (0.300"，7.62mm) | 16-DIP | S08 | 12 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
490
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 32QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (4x4) | S08 | 26 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
437
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8KB FLASH 20SOIC
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Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | ARM Cortex-M0+ | 18 | 48MHz | 1K x 8 | 2.7 V ~ 5.5 V | A/D 10x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
266
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
40
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 24QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 18 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
480
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8-BIT S08QL 16-TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8K x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 8-BIT S08QL 20-TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | S08 | 18 | 20MHz | 8K x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
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KINETIS KE04: 48MHZ CORTEX-M0+ 5
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Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | ARM Cortex-M0+ | 14 | 48MHz | 1K x 8 | 2.7 V ~ 5.5 V | A/D 6x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | ARM Cortex-M0+ | 22 | 48MHz | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
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KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | ARM Cortex-M0+ | 18 | 48MHz | 1K x 8 | 2.7 V ~ 5.5 V | A/D 10x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
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S08FL 8-BIT MCU S08 CORE 8KB F
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 30 | 20MHz | 768 x 8 | 4.5 V ~ 5.5 V | A/D 12x8b | Internal | SCI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 26 MPQ: 1
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IC MCU 8BIT 8KB FLASH 28SOIC
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Tray | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | S08 | 22 | 20MHz | 512 x 8 | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit |
