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- Supplier Device Package:
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- Core Processor:
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Discover 13 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
5,725
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 26 | 50MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 10x12b | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
4,952
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 16SOP
|
Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | ARM Cortex-M0+ | 14 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 6x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
455
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32SDIP
|
Tube | S08 | -40°C ~ 85°C (TA) | 32-SDIP (0.400",10.16mm) | 32-SDIP | S08 | 30 | 20MHz | 16KB (16K x 8) | 4.5 V ~ 5.5 V | A/D 12x8b | SCI | 8-Bit | ||||
NXP USA Inc. |
435
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 28SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | S08 | 22 | 50MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 10x12b | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
1,057
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-LQFP | 44-LQFP (10x10) | S08 | 34 | 50MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 10x12b | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
2,228
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 30 | 20MHz | 16KB (16K x 8) | 4.5 V ~ 5.5 V | A/D 12x8b | SCI | 8-Bit | ||||
NXP USA Inc. |
2,877
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | S08 | 38 | 50MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 10x12b | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
437
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 20SOIC
|
Tube | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | ARM Cortex-M0+ | 18 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 10x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | ARM Cortex-M0+ | 14 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 6x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | ARM Cortex-M0+ | 22 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 12x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | ARM Cortex-M0+ | 18 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 10x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
749
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8KB FLASH 24QFN
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | ARM Cortex-M0+ | 22 | 48MHz | 8KB (8K x 8) | 2.7 V ~ 5.5 V | A/D 12x12b,D/A 2x6b | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2450 MPQ: 1
|
S08QE 8-BIT MCU S08 CORE 16KB
|
Tray | S08 | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S08 | 26 | 50MHz | 16KB (16K x 8) | 1.8 V ~ 3.6 V | A/D 10x12b | I2C,LINbus,SCI,SPI | 8-Bit |