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Discover 44 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
4,564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 50MHz | 4K x 8 | 64KB (64K x 8) | - | 1.8 V ~ 3.6 V | A/D 22x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,860
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | S08 | 54 | 50MHz | 8K x 8 | 128KB (128K x 8) | - | 1.8 V ~ 3.6 V | A/D 22x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
3,144
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF51QE | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 8K x 8 | 128KB (128K x 8) | - | 1.8 V ~ 3.6 V | A/D 20x12b | Internal | I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
6,889
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF51JM | -40°C ~ 105°C (TA) | Coldfire V1 | 51 | 50MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b | External | CANbus，I2C，SCI，SPI，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,604
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 32K x 8 | 256KB (256K x 8) | - | 2.7 V ~ 5.5 V | A/D 20x12b | External | CANbus，I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
975
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,612
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
310
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 57 | 20MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | MCF51JM | -40°C ~ 105°C (TA) | Coldfire V1 | 51 | 50MHz | 16K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b | External | CANbus，I2C，SCI，SPI，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,018
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | MCF51QE | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 8K x 8 | 64KB (64K x 8) | - | 1.8 V ~ 3.6 V | A/D 20x12b | Internal | I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
810
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | MCF51JM | -40°C ~ 105°C (TA) | Coldfire V1 | 51 | 50MHz | 16K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b | External | CANbus，I2C，SCI，SPI，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
364
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | MCF51QE | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 20x12b | Internal | I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,099
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF51CN | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 24K x 8 | 128KB (128K x 8) | - | 1.8 V ~ 3.6 V | A/D 12x12b | External | Ethernet，I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
164
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 105°C (TA) | Coldfire V1 | 54 | 50MHz | 32K x 8 | 256KB (256K x 8) | - | 2.7 V ~ 5.5 V | A/D 20x12b | External | CANbus，I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
320
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 57 | 20MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | Coldfire V1 | 54 | 50MHz | 32K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 20x12b | External | CANbus，I2C，SCI，SPI | 32-Bit | ||
|
|
|
NXP USA Inc. |
132
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 57 | 40MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | ARM Cortex-M0+ | 58 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit |
