- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Selected conditions:
Discover 49 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Connectivity | ||
NXP USA Inc. |
2,450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
370
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32QFN
|
Tray | -40°C ~ 125°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 48KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC 16-BIT MCU S12 64K 48QFP
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64K FLASH,6K RAM
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 48K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 48K
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 8K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 512 x 8 | 8KB (8K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 8K
|
Tray | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 512 x 8 | 8KB (8K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | I2C,IrDA,LINbus,SCI,SPI,UART/USART |