- Packaging：
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- Operating Temperature：
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- Supplier Device Package：
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Discover 59 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
323
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 64LQFP
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Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | S12Z | 31 | 40MHz | 4K x 8 | 128 x 8 | 3.5 V ~ 40 V | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,450
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32LQFP
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Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,482
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
370
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32QFN
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Tray | -40°C ~ 125°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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Cut Tape (CT) | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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- | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 32K
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Cut Tape (CT) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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- | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
490
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
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Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
126
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
904
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，PWM，WDT | S12Z | 31 | 40MHz | 4K x 8 | 128 x 8 | 3.5 V ~ 40 V | A/D 4x12b | LINbus，SCI | ||
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NXP USA Inc. |
49
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 12V1 | 16 | 25MHz | 2K x 8 | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,500
|
3 days |
-
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MOQ: 1500 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | S12Z | 31 | 50MHz | 4K x 8 | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | S12Z | 19 | 32MHz | 1K x 8 | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART |
