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Discover 83 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Connectivity | |
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NXP USA Inc. |
1,280
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 12
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Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 8K x 8 | 128KB (128K x 8) | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
958
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tray | -40°C ~ 125°C (TA) | 80-LQFP Exposed Pad | 80-TQFP-EP (12x12) | DMA，POR，PWM，WDT | 32K x 8 | 256KB (256K x 8) | 1K x 8 | A/D 16x12b | CANbus，SCI，SPI | ||
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NXP USA Inc. |
1,500
|
3 days |
-
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MOQ: 1500 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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S12Z CORE16K FLASH
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，WDT | 2K x 8 | 16KB (16K x 8) | 128 x 8 | A/D 4x12b | SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
S12Z CORE16K FLASH
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Tray | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，WDT | 2K x 8 | 16KB (16K x 8) | 128 x 8 | A/D 4x12b | SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，WDT | 2K x 8 | 16KB (16K x 8) | 128 x 8 | A/D 9x12b | SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 128 x 8 | A/D 4x12b | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 128 x 8 | A/D 4x12b | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 128 x 8 | A/D 4x12b | LINbus，SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 800 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 16
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Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，WDT | 2K x 8 | 16KB (16K x 8) | 128 x 8 | A/D 9x12b | SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 128 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 64KB (64K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 8K x 8 | 128KB (128K x 8) | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 64KB (64K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 8K x 8 | 128KB (128K x 8) | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 8K x 8 | 128KB (128K x 8) | 512 x 8 | A/D 9x12b | LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 4K x 8 | 32KB (32K x 8) | 512 x 8 | A/D 9x12b | CANbus，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 8K x 8 | 128KB (128K x 8) | 512 x 8 | A/D 9x12b | CANbus，SCI，SPI |
