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Discover 229 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
1,602
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 192KB FLASH 64LQFP
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Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 42 | 32MHz | 12K x 8 | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 16x12b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
323
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 64LQFP
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Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 31 | 40MHz | 4K x 8 | 32KB (32K x 8) | 128 x 8 | 3.5 V ~ 40 V | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,450
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32LQFP
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Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,482
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
370
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32QFN
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Tray | -40°C ~ 125°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | LVD，POR，PWM，WDT | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 48LQFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | 34 | 32MHz | 1K x 8 | 128KB (128K x 8) | 512 x 8 | 5.5 V ~ 18 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
490
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
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Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | LVD，POR，PWM，WDT | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 16KB FLASH 48LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 48LQFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
832
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 19
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 28 | 32MHz | 12K x 8 | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 16KB FLASH 48LQFP
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Tray | -40°C ~ 150°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
465
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 19
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 28 | 32MHz | 12K x 8 | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x12b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
266
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 64KB FLASH 144LQFP
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Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，LCD，POR，PWM，WDT | 100 | 32MHz | 4K x 8 | 64KB (64K x 8) | 2K x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
904
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) | DMA，POR，PWM，WDT | 31 | 40MHz | 4K x 8 | 32KB (32K x 8) | 128 x 8 | 3.5 V ~ 40 V | A/D 4x12b | LINbus，SCI | ||
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NXP USA Inc. |
1,280
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
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Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 31 | 50MHz | 8K x 8 | 128KB (128K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
300
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 144LQFP
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Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，LCD，POR，PWM，WDT | 100 | 32MHz | 8K x 8 | 128KB (128K x 8) | 4K x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
958
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tray | -40°C ~ 125°C (TA) | 80-LQFP Exposed Pad | 80-TQFP-EP (12x12) | DMA，POR，PWM，WDT | 31 | 50MHz | 32K x 8 | 256KB (256K x 8) | 1K x 8 | 3.5 V ~ 40 V | A/D 16x12b | CANbus，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART |
