- Packaging：
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- Operating Temperature：
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- Core Processor：
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- Speed：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Selected conditions:
Discover 81 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
1,482
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 128KB (128K x 8) | 512 x 8 | 5.5 V ~ 18 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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|
|
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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|
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 48KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC 16-BIT MCU S12 64K 48QFP
|
Tray | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | DMA，LVD，POR，PWM，WDT | S12Z | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | DMA，LVD，POR，PWM，WDT | S12Z | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
64K FLASH，6K RAM
|
Tray | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
832
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM，WDT | S12Z | 28 | 32MHz | 12K x 8 | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 48LQFP
|
Tray | -40°C ~ 150°C (TA) | DMA，LVD，POR，PWM，WDT | S12Z | 15 | 32MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 5x10b | LINbus，SCI，SPI | ||
|
|
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NXP USA Inc. |
465
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | -40°C ~ 125°C (TA) | DMA，POR，PWM，WDT | S12Z | 28 | 32MHz | 12K x 8 | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x12b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 48K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
|
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|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 48K
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 12
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | DMA，POR，PWM，WDT | S12Z | 28 | 32MHz | 8K x 8 | 128KB (128K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 8K
|
Tray | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 512 x 8 | 8KB (8K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tray | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 16
|
Tray | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | S12Z | 34 | 32MHz | 1K x 8 | 16KB (16K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART |
