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Discover 119 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
2,450
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32LQFP
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Tray | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,482
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
370
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 32QFN
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Tray | -40°C ~ 125°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48LQFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | S12Z | 34 | 32MHz | 1K x 8 | 128KB (128K x 8) | 512 x 8 | 5.5 V ~ 18 V | A/D 10x10b，D/A 1x8b | CANbus，I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 32K
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 32K
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Cut Tape (CT) | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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- | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 32K
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 32K
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Cut Tape (CT) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 32K
|
- | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
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MAGNIV 16-BIT MCU S12 CORE 64K
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 64K
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Cut Tape (CT) | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12 CORE 64K
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- | -40°C ~ 125°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
490
|
3 days |
-
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MOQ: 1 MPQ: 1
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MAGNIV 16-BIT MCU S12Z CORE 32
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Tray | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-QFN-EP (5x5) | S12Z | 19 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 6x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | S12Z | 34 | 32MHz | 1K x 8 | 32KB (32K x 8) | 128 x 8 | 5.5 V ~ 18 V | A/D 10x10b | I2C，IrDA，LINbus，SCI，SPI，UART/USART | ||
|
|
|
NXP USA Inc. |
126
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 32LQFP
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | 12V1 | 16 | 25MHz | 2K x 8 | 32KB (32K x 8) | 128 x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 48KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 48KB (48K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC 16-BIT MCU S12 64K 48QFP
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Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
64K FLASH，6K RAM
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 12V1 | 28 | 25MHz | 2K x 8 | 64KB (64K x 8) | 512 x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | IrDA，LINbus，SCI，SPI |
