Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Operating Temperature Package / Case Supplier Device Package Number of I/O
LPC11A04UK,118
NXP USA Inc.
3,000
3 days
-
MOQ: 3000  MPQ: 1
IC MCU 32BIT 32KB FLASH 20WLCSP
Tape & Reel (TR) -40°C ~ 85°C (TA) 20-UFBGA,WLCSP 20-WLCSP (2.55x2.55) 18
LPC11A04UK,118
NXP USA Inc.
3,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 20WLCSP
Cut Tape (CT) -40°C ~ 85°C (TA) 20-UFBGA,WLCSP 20-WLCSP (2.55x2.55) 18
LPC11A04UK,118
NXP USA Inc.
3,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 20WLCSP
- -40°C ~ 85°C (TA) 20-UFBGA,WLCSP 20-WLCSP (2.55x2.55) 18
LPC11A14FHN33/301,
NXP USA Inc.
200
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray -40°C ~ 85°C (TA) 32-VQFN Exposed Pad 32-HVQFN (7x7) 28
LPC11A14FBD48/301,
NXP USA Inc.
213
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48LQFP
Tray -40°C ~ 85°C (TA) 48-LQFP 48-LQFP (7x7) 42
LPC11A14JBD48/30QL
NXP USA Inc.
Inquiry
-
-
MOQ: 250  MPQ: 1
IC MCU 32BIT 32KB FLASH 48LQFP
Tray -40°C ~ 105°C (TA) 48-LQFP 48-LQFP (7x7) 28