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Discover 33 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
1,055
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 64LQFP
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Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 54 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
4,403
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 64LQFP
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Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 54 | 24K x 8 | 128KB (128K x 8) | 2K x 8 | 3 V ~ 3.6 V | A/D 16x12b，8x16b，D/A 1x12b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
539
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 256KB FLASH 100LQFP
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Tray | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 86 | 32K x 8 | 256KB (256K x 8) | 2K x 8 | 3 V ~ 3.6 V | A/D 16x12b，16x16b，D/A 1x12b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
3,770
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 32QFN
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Tray | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 26 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b; D/A 2x12b | I2C，SCI，SPI | ||
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NXP USA Inc. |
276
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 48LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
264
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 32LQFP
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Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | DMA，POR，PWM，WDT | 26 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b; D/A 2x12b | I2C，SCI，SPI | ||
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NXP USA Inc. |
490
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 32QFN
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Tray | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 26 | 3K x 16 | 32KB (16K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b; D/A 2x12b | I2C，SCI，SPI | ||
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NXP USA Inc. |
250
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 32LQFP
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Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | DMA，POR，PWM，WDT | 26 | 3K x 16 | 32KB (16K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b; D/A 2x12b | I2C，SCI，SPI | ||
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NXP USA Inc. |
250
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 48LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 3K x 16 | 32KB (16K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
264
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 80LQFP
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Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-FQFP (12x12) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 68 | 24K x 8 | 128KB (128K x 8) | 2K x 8 | 3 V ~ 3.6 V | A/D 16x12b，10x16b，D/A 1x12b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
62
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 256KB FLASH 80LQFP
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Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-FQFP (12x12) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 68 | 32K x 8 | 256KB (256K x 8) | 2K x 8 | 3 V ~ 3.6 V | A/D 16x12b，10x16b，D/A 1x12b | CANbus，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,000
|
3 days |
-
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MOQ: 2000 MPQ: 1
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32-BIT DSC 56800EX CORE 64KB F
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
1,500
|
3 days |
-
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MOQ: 1500 MPQ: 1
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IC MCU 32BIT 64KB FLASH 64LQFP
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，POR，PWM，WDT | 54 | 4K x 16 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 16x12b，D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC DSC 32-BIT 32-LQFP
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Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 26 | 8K x 8 | 32KB (16K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b | SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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IC DSC 32-BIT 48-LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 39 | 8K x 8 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b | SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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IC DSC 32-BIT 32-LQFP
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Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | DMA，LVD，POR，PWM，WDT | 26 | 8K x 8 | 64KB (32K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b | SCI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 3K x 16 | 32KB (16K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
32-BIT DSC 56800EX CORE 48KB F
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 4K x 16 | 48KB (24K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 250 MPQ: 1
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IC MCU 32BIT 48KB FLASH 48LQFP
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Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | 39 | 4K x 16 | 48KB (24K x 16) | - | 2.7 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | CANbus，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 490 MPQ: 1
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IC MCU 32BIT 48KB FLASH 32QFN
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Tray | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，POR，PWM，WDT | 26 | 4K x 16 | 48KB (24K x 16) | - | 2.7 V ~ 3.6 V | A/D 6x12b; D/A 2x12b | I2C，SCI，SPI |
