- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- Number of I/O：
-
- Speed：
-
- RAM Size：
-
- Program Memory Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Oscillator Type：
-
- Selected conditions:
Discover 93 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|
|
|
NXP USA Inc. |
1,245
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 32LQFP
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | POR，PWM，WDT | 56800E | 26 | 32MHz | 2K x 16 | 16KB (8K x 16) | 3 V ~ 3.6 V | A/D 6x12b | Internal | I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
4,318
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，WDT | 56800E | 53 | 32MHz | 4K x 16 | 64KB (32K x 16) | 3 V ~ 3.6 V | A/D 16x12b; D/A 2x12b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,215
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，Temp Sensor，WDT | 56800E | 21 | 60MHz | 6K x 16 | 32KB (16K x 16) | 2.25 V ~ 3.6 V | A/D 6x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,606
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 64LQFP
|
Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，Temp Sensor，WDT | 56800E | 27 | 60MHz | 12K x 8 | 32KB (16K x 16) | 2.25 V ~ 3.6 V | A/D 8x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,733
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，Temp Sensor，WDT | 56800E | 21 | 60MHz | 6K x 16 | 32KB (16K x 16) | 2.25 V ~ 3.6 V | A/D 6x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,568
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 64LQFP
|
Tray | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，Temp Sensor，WDT | 56800E | 27 | 60MHz | 12K x 8 | 32KB (16K x 16) | 2.25 V ~ 3.6 V | A/D 8x12b | Internal | CANbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，Temp Sensor，WDT | 56800E | 62 | 60MHz | 6K x 16 | 128KB (64K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,570
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 128LQFP
|
Tray | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR，PWM，Temp Sensor，WDT | 56800E | 49 | 60MHz | 6K x 16 | 128KB (64K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,432
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，Temp Sensor，WDT | 56800E | 62 | 60MHz | 18K x 16 | 512KB (256K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,007
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 160LQFP
|
Tray | -40°C ~ 105°C (TA) | 160-LQFP | 160-LQFP (24x24) | POR，PWM，Temp Sensor，WDT | 56800E | 76 | 60MHz | 18K x 16 | 512KB (256K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 28SOIC
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | LVD，POR，PWM，WDT | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | 1.8 V ~ 3.6 V | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 28SOIC
|
Cut Tape (CT) | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | LVD，POR，PWM，WDT | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | 1.8 V ~ 3.6 V | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 28SOIC
|
- | -40°C ~ 105°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | LVD，POR，PWM，WDT | 56800E | 23 | 32MHz | 1K x 16 | 16KB (8K x 16) | 1.8 V ~ 3.6 V | A/D 15x12b | Internal | I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，WDT | 56800E | 53 | 32MHz | 4K x 16 | 64KB (32K x 16) | 3 V ~ 3.6 V | A/D 16x12b; D/A 2x12b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
6,609
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Cut Tape (CT) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，WDT | 56800E | 53 | 32MHz | 4K x 16 | 64KB (32K x 16) | 3 V ~ 3.6 V | A/D 16x12b; D/A 2x12b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
6,609
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
- | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | POR，PWM，WDT | 56800E | 53 | 32MHz | 4K x 16 | 64KB (32K x 16) | 3 V ~ 3.6 V | A/D 16x12b; D/A 2x12b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,516
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | 56800E | 39 | 32MHz | 4K x 16 | 64KB (32K x 16) | 3 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | Internal | CANbus，I2C，SCI，SPI | ||
|
|
|
NXP USA Inc. |
235
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，Temp Sensor，WDT | 56800E | 62 | 60MHz | 10K x 16 | 256KB (128K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
197
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 160LQFP
|
Tray | -40°C ~ 105°C (TA) | 160-LQFP | 160-LQFP (24x24) | POR，PWM，Temp Sensor，WDT | 56800E | 76 | 60MHz | 10K x 16 | 256KB (128K x 16) | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
4,640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 32LQFP
|
Tray | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，POR，PWM，WDT | 56800E | 27 | 32MHz | 1K x 16 | 16KB (8K x 16) | 1.8 V ~ 3.6 V | A/D 18x12b | Internal | I2C，LINbus，SCI，SPI |
