Discover 72 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package Number of I/O RAM Size Program Memory Size Data Converters
DSPIC33EV32GM002-I/SO
Microchip Technology
287
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 32KB FLASH 28SOIC
Tube 28-SOIC (0.295",7.50mm Width) 28-SOIC 21 2K x 16 32KB (11K x 24) A/D 11x10/12b
DSPIC33EV64GM004-I/PT
Microchip Technology
310
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 44TQFP
Tray 44-TQFP 44-TQFP (10x10) 35 4K x 16 64KB (22K x 24) A/D 24x10/12b
DSPIC33EV128GM003T-I/M5
Microchip Technology
3,300
3 days
-
MOQ: 3300  MPQ: 1
ECC FLASH,8KB RAM
Tape & Reel (TR) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 128KB (43K x 24) A/D 13x10b/12b
DSPIC33EV128GM003T-I/M5
Microchip Technology
3,300
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,8KB RAM
Cut Tape (CT) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 128KB (43K x 24) A/D 13x10b/12b
DSPIC33EV128GM003T-I/M5
Microchip Technology
3,300
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,8KB RAM
- 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 128KB (43K x 24) A/D 13x10b/12b
DSPIC33EV32GM002-I/MM
Microchip Technology
306
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 32KB FLASH 28QFN
Tube 28-VQFN Exposed Pad 28-QFN-S (6x6) 21 2K x 16 32KB (11K x 24) A/D 11x10/12b
DSPIC33EV32GM003-I/M5
Microchip Technology
730
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,4KB RAM
Tube 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 4K x 16 32KB (11K x 24) A/D 13x10b/12b
DSPIC33EV32GM002-I/SP
Microchip Technology
286
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 32KB FLASH 28SDIP
Tube 28-DIP (0.300",7.62mm) 28-SPDIP 21 2K x 16 32KB (11K x 24) A/D 11x10/12b
DSPIC33EV64GM003-I/M5
Microchip Technology
584
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,8KB RAM
Tube 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 64KB (22K x 24) A/D 13x10b/12b
DSPIC33EV128GM003-I/M5
Microchip Technology
584
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,8KB RAM
Tube 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 128KB (43K x 24) A/D 13x10b/12b
DSPIC33EV64GM006-I/PT
Microchip Technology
640
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 64TQFP
Tray 64-TQFP 64-TQFP (10x10) 53 4K x 16 64KB (22K x 24) A/D 36x10/12b
DSPIC33EV256GM003-I/M5
Microchip Technology
584
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,16KB RAM
Tube 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 16K x 16 256KB (85.5K x 24) A/D 13x10b/12b
DSPIC33EV128GM006-I/PT
Microchip Technology
412
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 128KB FLASH 64TQFP
Tray 64-TQFP 64-TQFP (10x10) 53 4K x 16 128KB (43K x 24) A/D 36x10/12b
DSPIC33EV256GM002-I/SP
Microchip Technology
214
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 256KB FLASH 28SDIP
Tube 28-DIP (0.300",7.62mm) 28-SPDIP 21 8K x 16 256KB (85.5K x 24) A/D 11x10/12b
DSPIC33EV256GM004-I/PT
Microchip Technology
290
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 256KB FLASH 44TQFP
Tray 44-TQFP 44-TQFP (10x10) 35 8K x 16 256KB (85.5K x 24) A/D 24x10/12b
DSPIC33EV32GM003T-I/M5
Microchip Technology
Inquiry
-
-
MOQ: 3300  MPQ: 1
ECC FLASH,4KB RAM
Tape & Reel (TR) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 4K x 16 32KB (11K x 24) A/D 13x10b/12b
DSPIC33EV32GM003T-I/M5
Microchip Technology
3,284
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,4KB RAM
Cut Tape (CT) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 4K x 16 32KB (11K x 24) A/D 13x10b/12b
DSPIC33EV32GM003T-I/M5
Microchip Technology
3,284
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,4KB RAM
- 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 4K x 16 32KB (11K x 24) A/D 13x10b/12b
DSPIC33EV64GM003T-I/M5
Microchip Technology
Inquiry
-
-
MOQ: 3300  MPQ: 1
ECC FLASH,8KB RAM
Tape & Reel (TR) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 64KB (22K x 24) A/D 13x10b/12b
DSPIC33EV64GM003T-I/M5
Microchip Technology
3,298
3 days
-
MOQ: 1  MPQ: 1
ECC FLASH,8KB RAM
Cut Tape (CT) 36-UFQFN Exposed Pad 36-UQFN (5x5) 25 8K x 16 64KB (22K x 24) A/D 13x10b/12b