Discover 41 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package Number of I/O RAM Size Program Memory Size Voltage - Supply (Vcc/Vdd)
LPC1114FHN33/302:5
NXP USA Inc.
3,714
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 8K x 8 32KB (32K x 8) 1.8 V ~ 3.6 V
LPC1114FBD48/302,1
NXP USA Inc.
2,918
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 32KB (32K x 8) 1.8 V ~ 3.6 V
LPC1114FHN33/333,5
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 56KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 8K x 8 56KB (56K x 8) 1.8 V ~ 3.6 V
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 4000  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tape & Reel (TR) 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 2K x 8 8KB (8K x 8) 1.8 V ~ 3.6 V
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Cut Tape (CT) 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 2K x 8 8KB (8K x 8) 1.8 V ~ 3.6 V
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
- 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 2K x 8 8KB (8K x 8) 1.8 V ~ 3.6 V
LPC1113FBD48/302,1
NXP USA Inc.
4,771
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 24KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 24KB (24K x 8) 1.8 V ~ 3.6 V
LPC1111FHN33/102,5
NXP USA Inc.
3,120
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 33-HVQFN (7x7) 28 2K x 8 8KB (8K x 8) 1.8 V ~ 3.6 V
LPC1114FHI33/303,5
NXP USA Inc.
1,116
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray 32-VFQFN Exposed Pad 32-HVQFN (5x5) 28 8K x 8 32KB (32K x 8) 1.8 V ~ 3.6 V
LPC1114FBD48/303,1
NXP USA Inc.
158
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 32KB (32K x 8) 1.8 V ~ 3.8 V
LPC1114FBD48/323,1
NXP USA Inc.
380
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 48KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 48KB (48K x 8) 1.8 V ~ 3.6 V
LPC1114FBD48/333,1
NXP USA Inc.
345
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 56KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 56KB (56K x 8) 1.8 V ~ 3.6 V
LPC1114FHI33/302,5
NXP USA Inc.
384
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray 32-VFQFN Exposed Pad 32-HVQFN (5x5) 28 8K x 8 32KB (32K x 8) 1.8 V ~ 3.6 V
LPC1113FBD48/303,1
NXP USA Inc.
55
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 24KB FLASH 48LQFP
Tray 48-LQFP 48-LQFP (7x7) 42 8K x 8 24KB (24K x 8) 1.8 V ~ 3.6 V
LPC1111FHN33/203,5
NXP USA Inc.
252
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 4K x 8 8KB (8K x 8) 1.8 V ~ 3.6 V
LPC1112FHN33/103,5
NXP USA Inc.
320
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 2K x 8 16KB (16K x 8) 1.8 V ~ 3.6 V
LPC1112FHN33/202,5
NXP USA Inc.
674
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 4K x 8 16KB (16K x 8) 1.8 V ~ 3.6 V
LPC1112FHN33/203,5
NXP USA Inc.
29
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 4K x 8 16KB (16K x 8) 1.8 V ~ 3.6 V
LPC1112FHI33/203,5
NXP USA Inc.
205
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray 32-VFQFN Exposed Pad 32-HVQFN (5x5) 28 4K x 8 16KB (16K x 8) 1.8 V ~ 3.6 V
LPC1114FHN33/202,5
NXP USA Inc.
487
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray 32-VQFN Exposed Pad 32-HVQFN (7x7) 28 4K x 8 32KB (32K x 8) 1.8 V ~ 3.6 V