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Discover 18 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 6MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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MOQ: 450 MPQ: 1
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IC MCU 32BIT 6MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | - | 180MHz | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 6MB FLASH 416BGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | e200z7 | - | 180MHz | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 6MB FLASH 516FBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | e200z7 | - | 180MHz | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | CANbus,EBI/EMI,SCI,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tray | MPC57xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | e200z2,e200z4 | 129 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE,6M FLASH,768
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
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DUAL CORE,6M FLASH,768
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
DUAL CORE 6M FLASH 768K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
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NXP 32-BIT MCU 6MB FLASH 160MH
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,LVD,POR,WDT | e200z2,e200z4 | 178 | 80MHz/160MHz | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG |